Offers high speed flip chip die sorting, high speed LED chip attach, high speed flip chip LED chip attach and reel-to-reel chip attach production solutions. By ...

Flip chip device assembly entails three basic steps: a die pick-up, an alignment and placement to the package/substrate footprint, and a final attachment or bonding step. For pick-up, die can be ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.