Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...

The Asia-Pacific region was the largest market for Flip Chip technology in 2023, holding 38.1% of the market share... In 2023, the 2.5D IC Packaging segment dominated the Flip Chip market ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Nexperia has unveiled a new portfolio of high signal integrity, bidirectional automotive ESD protection dIodes.

Flip Chip Ball Grid Array (FCBGA) technology has become a cornerstone of modern semiconductor packaging, offering superior electrical and thermal performance. As electronic devices demand higher power ...

Summary: Samsung has reportedly decided to use the Exynos 2400e chip, an underclocked version of the Exynos 2400, in the affordable Galaxy Z Flip FE. Recent reports of persistent issues with Samsung’s ...

We've reviewed code that suggests that Samsung could pack the Exynos 2400e on the Galaxy Z Flip FE, as against the 2500 as per other leaks.

Now, Samsung plans to use the 3nm Exynos 2500 chip in some of its next-gen foldables, including the Galaxy Z Flip 7 and Galaxy Z Flip FE. A top Samsung executive revealed interesting details about ...

Lastly, the reduced thickness of the bonded connections in Cu-Cu Hybrid Bonding, nearly eliminating the 10-30 micron thickness of solder balls in flip-chip technology, opens up new possibilities for ...