IC manufacturers have yet to fully optimize the high-volume manufacturing cost structure for the 300mm wafer size. However, the potential per-die cost savings that the larger wafer can provide is ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Within the semiconductor industry, there is a continual demand for integrated circuits (IC) that exhibit higher performance at a lower cost than its predecessors. Wafer metrology tools are used to ...

The brief was that the wafer probe yield was disastrous ... lines and the scan chain hookup The naïve IC design is one that forgoes testability in pursuit of die area, development time and ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Request A Quote Download PDF Copy Request A Quote Download ...

The BlackStar offers versatility in processing various die sizes ... Laser type will depend on wafer material and marking requirements. About Laser Marking of IC Mold Compounds These systems ...