But size is not everything As semiconductor manufacturers continue to push the boundaries of fabrication technology, SRAM ...
The GDDR7 SGRAM specification supports a maximum data transfer rate of 48 GT/s, but the first generation GDDR7 memory devices ...
Samsung will details its future plans for ultra-fast and ultra-dense 3D TLC NAND, designed for next-generation SSDs. Samsung ...
What: eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, is presenting a paper at the International Solid-State Circuits Conference ...
The work's results were presented Feb. 17 at ISSCC 2020 in the paper, "A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet ...