High-accuracy packaging in panel level packaging ~ TOKYO, JP / ACCESS Newswire / March 27, 2025 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray ...

Protective packaging is projected to make up 43.1% of the logistics packaging market by the end of 2024. The logistics ...

However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters ...