The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". [2] …

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the …

TO-220 is an insertion-mount package with a lead pitch of 2.54mm. TO-220 has a metal tab for mounting on a heat sink. TO-220 has screw holes at the top of the package so that it can be …

(8) Outline conforms to JEDEC® TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline SYMBOL MILLIMETERS INCHES …

TO-220 and TO-220AB package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

The transistor outline (TO) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts. The …

By addressing these common pitfalls and understanding the troubleshooting steps outlined here, you can enhance the reliability and effectiveness of your circuit designs using components …

The TO-220 is a type of plastic-molded package that features a flat metal tab at its back (see Figure 1) to enable it to dissipate relatively large amounts of heat. The TO-220 is commonly …

The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1inches pin spacing. The "TO" designation stands for "transistor outline". TO-220 …

The TO220, TO220F and TO247 are the popular packages for power devices because of their versatility and ability to dissipate moderate amounts of heat. This application note describes …