A large, single monolithic, die will be more prone to having irrecoverable defects than a smaller die, causing lower yield and higher overall cost. In a chiplet based design, each chiplet is smaller, so the amount of silicon (die) that needs to be thrown away for an irrecoverable die is less, leading to lower cost.

Studies have shown that a 360 mm² monolithic die will have a yield of 15 percent, while a 4-chiplet design (with each chiplet measuring 99 mm²) more than doubles the yield to 37 percent. Chiplets are inherently cheaper to manufacture since they waste less wafer space (smaller chips result in less wasted wafer as a percentage of the total).